AndTech 將於 5 月 14 日（週四）舉辦線上 Zoom 研討會，主題為「半導體 CMP 技術概要、材料去除機制、研磨砥粒開發與 সরবরাহ 分散性評估技術動向、後段清洗特點」
NQ 評分
0/100
N1 內容完整性
90
AI 摘要（NQ 加工版）
AndTech 將於 5 月 14 日舉辦關於半導體 CMP 技術及 সরবরাহ 評估的專業線上研討會。
AI 分析
常見問題
- Q: What is the main topic of the AndTech seminar?
- A: The seminar focuses on the overview of semiconductor CMP technology, material removal mechanisms, abrasive grain development, slurry dispersibility evaluation techniques, and the characteristics of post-cleaning processes.
- Q: When and how will the seminar be held?
- A: The seminar will be held online via Zoom on Thursday, May 14th, 2026, from 10:30 to 16:50.
- Q: Who is the target audience for this seminar?
- A: The seminar is designed for professionals involved in R&D and technical aspects of semiconductor manufacturing, particularly those dealing with CMP technology.
- Q: What is the participation fee?
- A: The participation fee is 60,500 yen (tax included). Materials will be distributed electronically.
- Q: How can I register for the seminar?
- A: You can find registration details and a link to the seminar on the AndTech website: https://andtech.co.jp/seminars/1f11e98b-a593-63b4-b280-064fb9a95405