AndTech 將於 5 月 28 日（星期四）舉辦線上 Zoom 研討會：「半導體微細化與先進封裝最新技術 ～ 光阻劑、微影、封裝用光阻劑、RDL 形成製程的趨勢、技術挑戰與未來展望 ～」
NQ 評分
50/100
AI 摘要（NQ 加工版）
AndTech 將舉辦一場關於半導體微細化與先進封裝技術的線上研討會。
尚無 AI 分析資料。
常見問題
- Q: What is the main topic of the AndTech seminar?
- A: The seminar focuses on the latest technologies in semiconductor miniaturization and advanced packaging, including trends, technical challenges, and future prospects related to resist, lithography, packaging resist, and RDL formation processes.
- Q: When and how will the seminar be held?
- A: The seminar will be held online via Zoom on Thursday, May 28th, 2026, from 10:00 to 17:00. A Zoom URL will be sent after registration.
- Q: What is the participation fee for the seminar?
- A: The participation fee is 49,500 yen (tax included). Course materials will be distributed electronically.
- Q: Who is the lecturer for this seminar?
- A: The lecturer is Masataka Endo, Representative of E-Reso Research.
- Q: What specific topics will be covered in the seminar?
- A: The seminar will cover trends in semiconductor miniaturization (resist, lithography) technologies, advanced semiconductor packaging technologies, characteristics and applications of packaging resists, and trends in the fine redistribution layer (RDL) formation process.