What is the main topic of the AndTech seminar?

The seminar focuses on the latest technologies in semiconductor miniaturization and advanced packaging, including trends, technical challenges, and future prospects related to resist, lithography, packaging resist, and RDL formation processes.

When and how will the seminar be held?

The seminar will be held online via Zoom on Thursday, May 28th, 2026, from 10:00 to 17:00. A Zoom URL will be sent after registration.

What is the participation fee for the seminar?

The participation fee is 49,500 yen (tax included). Course materials will be distributed electronically.

Who is the lecturer for this seminar?

The lecturer is Masataka Endo, Representative of E-Reso Research.

What specific topics will be covered in the seminar?

The seminar will cover trends in semiconductor miniaturization (resist, lithography) technologies, advanced semiconductor packaging technologies, characteristics and applications of packaging resists, and trends in the fine redistribution layer (RDL) formation process.

AI News NQ Analysis

AndTech 将于 5 月 28 日（星期四）举办在线 Zoom 研讨会：「半导体微细化与先进封装最新技术～光阻剂、微影、封装用光阻剂、RDL 形成制程的趋势、技术挑战与未来展望～」

尚無 AI 分析資料。

常見問題

Q: What is the main topic of the AndTech seminar?: A: The seminar focuses on the latest technologies in semiconductor miniaturization and advanced packaging, including trends, technical challenges, and future prospects related to resist, lithography, packaging resist, and RDL formation processes.
Q: When and how will the seminar be held?: A: The seminar will be held online via Zoom on Thursday, May 28th, 2026, from 10:00 to 17:00. A Zoom URL will be sent after registration.
Q: What is the participation fee for the seminar?: A: The participation fee is 49,500 yen (tax included). Course materials will be distributed electronically.
Q: Who is the lecturer for this seminar?: A: The lecturer is Masataka Endo, Representative of E-Reso Research.
Q: What specific topics will be covered in the seminar?: A: The seminar will cover trends in semiconductor miniaturization (resist, lithography) technologies, advanced semiconductor packaging technologies, characteristics and applications of packaging resists, and trends in the fine redistribution layer (RDL) formation process.