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デジタル製品・家電

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AraLink Inc. Signs ¥650 Million Commitment Line Agreement with Resona Bank

AraLink Inc. has secured a ¥650 million commitment line agreement with Resona Bank, dated March 30, 2026, to strengthen its financial base for business expansion and service enhancement. This funding will support the continued provision of their service "DareDemo Sumaho" (Anyone Phone), which aims to help those with past payment issues access mobile communication and reintegrate into society.

Source: prtimes.jp