[First Public Reveal] WOODMAN to Exhibit at "Japan IT Week Spring 2026," Unveiling Joint Solution "MICHIBIKI DC Panel Type" with Michibiki Inc. and the Latest "4U Liquid Immersion Cooling System" in Person

AI Summary (NQ-processed)

WOODMAN Co., Ltd. will exhibit at "Japan IT Week Spring 2026" to showcase their latest data center infrastructure solutions. The exhibition will feature the "MICHIBIKI DC Panel Type," a collaborative modular data center solution, and the "4U Liquid Immersion Cooling Solution" designed for high-density AI/GPU servers. These exhibits highlight WOODMAN's focus on next-generation infrastructure, speed of deployment, and advanced cooling technologies to address the growing demands of AI and HPC computing.