Valeo and Calyos Innovate Thermal Management for Data Center and Mobility Chips with Advanced Passive Two-Phase Cooling Solution

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Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

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Valeo and Calyos have partnered to develop a passive two-phase cooling solution that will revolutionize thermal management for chips in data centers and mobility. This technology addresses the heat challenges posed by AI and electrification, enabling efficient and reliable cooling.

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Source: https://prtimes.jp/main/html/rd/p/000000228.000004446.html | Date: Date unavailable

Valeo, a global leader in automotive technology, and Calyos, a pioneer in passive advanced two-phase Loop Heat Pipe (LHP) cooling solutions, have announced the signing of a Memorandum of Understanding (MoU). This aims to develop and industrialize high-performance, standalone chip cooling solutions for mobility and computing, addressing the increasing thermal management challenges driven by electrification and Artificial Intelligence (AI). By combining Calyos' expertise in Loop Heat Pipe technology with Valeo's world-class thermal system engineering, manufacturing scale, and global footprint, the two partners will deliver a new generation of passive advanced two-phase cooling systems that manage high heat flux more efficiently, are more compact, easier to integrate, and offer extreme reliability with no maintenance. Addressing the Future of Mobility As automotive electrification continues to scale and Software-Defined Vehicles (SDVs) advance, the computing power and heat generated by power electronics are increasing exponentially. Valeo and Calyos' passive two-phase cooling solution offers the following benefits: Power Electronics: Autonomous cooling for On-Board Chargers (OBCs), inverters, and "x-in-1" integrated power electronics, providing a compact, standalone, "plug-and-play" cooling system. For electronics located in the rear of the vehicle, this solution brings energy savings and simplification of the vehicle's cooling architecture. Software-Defined Vehicles (SDVs): SDV architectures drive the centralization of computing controllers with high power density requirements. The companies' solution enables standalone, compact, and reliable heat dissipation optimized for high-speed processors, ensuring reliability and ease of integration without the complexity of traditional distributed vehicle liquid cooling loops. Innovating Cooling Efficiency and AI Scalability for Data Centers Valeo leverages its decades of expertise in automotive thermal management to offer a c

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