[Semiconductor Back-end Process] Adoption of "Paper-based TPS Cleaning Sheet" for Semiconductor Encapsulation Mold Cleaning – Developed through Industry-Academia-Government Collaboration, Now in Use on Actual Production Lines

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Tohoku Butsuryu Co., Ltd. has announced the adoption of its "Paper-based TPS Cleaning Sheet" by a major domestic semiconductor manufacturer for cleaning resin encapsulation molds. This innovation, developed through industry-academia-government collaboration, reduces costs by 20-30% and improves operational efficiency while lowering environmental impact.