[Semiconductor Post-processing] Adoption of 'Paper-based TPS Cleaning Sheet' for Semiconductor Molding Mold Cleaning - Developed through Industry-Academia-Government Collaboration, Now in Use on Actual Manufacturing Lines
NQ Score
80/100
N1 Content Completeness
8
AI Summary (NQ-processed)
Tohoku Logistics' 'Paper-based TPS Cleaning Sheet' has been officially adopted for resin mold cleaning in a major domestic semiconductor manufacturer, achieving cost reductions and lower environmental impact.
AI Analysis
Frequently Asked Questions
- Q: What is the biggest benefit of TPS Cleaning Sheets?
- A: Compared to conventional products, they can reduce costs by 20-30% and lower environmental impact due to paper material.
- Q: Why can paper material be used in semiconductor processes?
- A: Thanks to Tohoku Logistics' unique patented technology, we have succeeded in suppressing 'particle generation' which is a problem in precision processes.
- Q: In which process is this product used?
- A: It is used for cleaning molds in the 'encapsulation process (molding)' where semiconductors are protected with resin.