Why is this technology receiving attention?

It enables low-cost, high-quality TGV formation by eliminating complex conventional processes, making it promising for high-performance packages like AI semiconductors.

Which equipment was used to achieve this?

It was demonstrated using Symphotony's ultra-precision femtosecond laser processing machine, 'Femto-pro'.

What are the advantages?

It features a simple configuration without special optical systems suitable for mass production, capable of achieving high aspect ratio processing.

AI News NQ Analysis

Demonstration of Deep-Hole Drilling for Next-Gen Semiconductor Packaging Glass Core Substrates Without Special Optical Systems

NQ Score 78/100

N1 Content Completeness 9

AI Summary (NQ-processed)

Symphotony has successfully demonstrated deep-hole and through-hole processing on glass using its 'Femto-pro' ultra-precision femtosecond laser processing machine, without relying on special optical systems. This simplified method is expected to contribute to the mass production of glass core substrates for next-generation semiconductor packaging by simplifying the TGV formation process.

AI Analysis

Frequently Asked Questions

Q: Why is this technology receiving attention?: A: It enables low-cost, high-quality TGV formation by eliminating complex conventional processes, making it promising for high-performance packages like AI semiconductors.
Q: Which equipment was used to achieve this?: A: It was demonstrated using Symphotony's ultra-precision femtosecond laser processing machine, 'Femto-pro'.
Q: What are the advantages?: A: It features a simple configuration without special optical systems suitable for mass production, capable of achieving high aspect ratio processing.