SVP Japan Co., Ltd. (Headquarters: Chuo-ku, Tokyo; President: Masashi Hashimoto; hereinafter referred to as "SVP Japan"), a provider of membership-based market research services, today released the SVP Focused Market Analysis Report "High Heat Resistance and High Heat Dissipation Materials - Current Status and Future Prospects of the Global Market -" for its member companies. ■ Global Market for High Heat Resistance and High Heat Dissipation Materials High heat resistance and high heat dissipation materials are functional materials that efficiently transfer and dissipate heat from heat sources such as semiconductor chips and battery cells to cooling mechanisms like heatsinks and liquid cooling plates. They include TIM (Thermal Interface Material), insulating heat dissipation ceramic substrates, and high heat resistance polymers. In recent years, with the advancement of EVs, AI servers, and power semiconductors, the biggest constraint factor influencing system performance, safety, and lifespan is shifting towards "heat." In fact, the latest GPUs generate heat exceeding the limits of air cooling, and even a slight temperature increase in EV batteries can lead to reduced lifespan, making thermal management increasingly critical. Going forward, driven by the increasing voltage of EVs, the widespread adoption of SiC and GaN semiconductors, and the liquid cooling of data centers, the market is expected to continue stable growth in the medium to long term. Promising areas include gap fillers for EVs, silicon nitride AMB substrates for SiC modules, and ultra-low thermal resistance TIMs for AI servers. ■ Market Overview of High Heat Resistance and High Heat Dissipation Materials The market for high heat resistance and high heat dissipation materials features different competitive structures for each material type, such as TIMs, insulating ceramic substrates, and high heat resistance polymers, and is led by European and American chemical manufacturers and Japanese functional