Sumitomo Bakelite Announces Start of Sampling for Liquid Encapsulant for Advanced Packages

AI Summary (NQ-processed)

Sumitomo Bakelite Co., Ltd. has developed and begun sampling its EME-L series of liquid encapsulants, featuring low warpage and high reliability, to address the increasing size and complexity of semiconductor packages driven by AI technology. By leveraging its existing technologies, this product contributes to more efficient manufacturing processes and supports the realization of next-generation packages. Sampling will begin in April 2026, with a target for certified adoption in 2027.