Sumitomo Bakelite will participate in ECTC 2026 in Orlando, Florida, presenting three research papers on advanced semiconductor packaging. Collaborating with Georgia Tech and Tohoku University, the company will showcase low-dielectric RDL materials for glass substrates, optical RDL interposer technology for Co-Packaged Optics (CPO), and high thermal conductivity encapsulants for automotive applications. These innovations target the high-density and reliability requirements of AI-driven chips, aiming to enhance the company's presence in the global next-generation electronics market.