What problem does this patent solve?

It suppresses stress and cracking caused by thermal expansion differences in 2.5D packages, improving semiconductor reliability.

Why is liquid encapsulant important?

It fills gaps and protects semiconductors from temperature and humidity, ensuring long-term stable operation.

What is Resonac's technological advantage?

It precisely controls thermal expansion and elasticity, and has successfully defended 8 patent oppositions.

AI News NQ Analysis

Decision to Maintain Patent for Liquid Encapsulant Used in Semiconductor Packages for Generative AI

Key facts

Decision to Maintain Patent for Liquid Encapsulant Used in Semiconductor Packages for Generative AI
Resonac Corporation announced that the Japan Patent Office has upheld the validity of its Japanese patent (Patent No. 7687499) related to liquid encapsulants for 2.5D semiconductor packages used in generative AI applications. This decision reinforces the company's technological leadership in advanced semiconductor materials.
Source: PR TIMES
Date: Wed Jun 17 2026 20:30:01 GMT+0900 (Japan Standard Time)

Direct answer

Resonac Corporation announced that the Japan Patent Office has upheld the validity of its Japanese patent (Patent No. 7687499) related to liquid encapsulants for 2.5D semiconductor packages used in generative AI applications. This decision reinforces the company's technological leadership in advanced semiconductor materials.

Citation: Decision to Maintain Patent for Liquid Encapsulant Used in Semiconductor Packages for Generative AI (Wed Jun 17 2026 20:30:01 GMT+0900 (Japan Standard Time)), PR TIMES
Source: PR TIMES
Date: Wed Jun 17 2026 20:30:01 GMT+0900 (Japan Standard Time)

AI Summary (NQ-processed)

Resonac Corporation announced that the Japan Patent Office has upheld the validity of its Japanese patent (Patent No. 7687499) related to liquid encapsulants for 2.5D semiconductor packages used in generative AI applications. This decision reinforces the company's technological leadership in advanced semiconductor materials.

AI Analysis

Frequently Asked Questions

Q: What problem does this patent solve?: A: It suppresses stress and cracking caused by thermal expansion differences in 2.5D packages, improving semiconductor reliability.
Q: Why is liquid encapsulant important?: A: It fills gaps and protects semiconductors from temperature and humidity, ensuring long-term stable operation.
Q: What is Resonac's technological advantage?: A: It precisely controls thermal expansion and elasticity, and has successfully defended 8 patent oppositions.