REGALI to Exhibit at "E-commerce Fair Osaka 2026"
NQ Score
36/100
N1 Content Completeness
4
AI Summary (NQ-processed)
REGALI Co., Ltd. announces its participation in the "E-commerce Fair Osaka 2026" held at My Dome Osaka on May 27th and 28th, 2026, showcasing its integrated EC platform "LEEEP" and unveiling a new service under development.