PingCAP K.K. announced that it will sponsor AI Engineering Summit Tokyo 2026 as a Gold Sponsor. The conference will be held over two days, June 8 and 9, 2026, and is designed for engineers and leaders who use, build, and promote AI agents. The event will gather practical case studies and insights from real-world implementation, operations, and organizational rollout efforts, helping participants bring back concrete ideas for changing development practices within their own companies and applying them immediately. PingCAP will exhibit at a special booth and deliver a session on the first day, Monday, June 8. Event overview: AI Engineering Summit Tokyo 2026 will take place from 9:00 to 21:00 on Monday, June 8 and Tuesday, June 9, 2026, at Hamamatsucho Convention Hall & Hybrid Studio. The event is organized by Findy Inc. Admission is free with advance registration. The event website is https://ai-engineering-summit-tokyo.findy-tools.io/2026-summer. Session overview: The session will be held on Monday, June 8, 2026, from 14:00 to 14:30 in Room A. The session title is “Product Development and Organizational Transformation Accelerated by AI Agents: Lessons from the TiDB Product Suite.” PingCAP, which advocates an “AI-first” approach, is rapidly bringing AI agent-oriented products such as TiDB X, TiDB Cloud Zero, and mem9 to market. To accelerate this development, the company is transforming its organizational structure and development processes around the premise of AI adoption. The session will explain how AI is changing product development on the ground and how AI agents are being rolled out company-wide in support operations. It will also introduce concrete examples of cross-functional co-creation enabled by AI and share practical knowledge for making AI function as a core organizational capability. Speakers include Masatoshi Sekiguchi, TiDB X Evangelist at PingCAP K.K. After working as a DBA, architect, and project manager at a financial systems integrator, mainly on s