OKI Establishes 180-Layer, 15mm-Thick PCB Technology for Next-Gen AI Semiconductor Testing Equipment
NQ Score
47/100
N1 Content Completeness
5
AI Summary (NQ-processed)
OKI Circuit Technology has successfully developed a 180-layer, 15mm-thick PCB for AI chip testing (HBM), breaking the previous industry limit of 124 layers. Mass production is targeted for October 2026.