MECCANISMO・LAB Achieves Wafer Bonding at 120℃ and Atmospheric Pressure, Develops 6-inch Fully Automatic Bonding Machine Based on NIMS's Technology
NQ Score
0/100
N1 Content Completeness
5
AI Summary (NQ-processed)
MECCANISMO・LAB has developed a fully automatic 6-inch wafer bonding machine that operates at 120℃ and atmospheric pressure, based on NIMS's low-temperature, atmospheric-pressure bonding technology. This development addresses traditional challenges and initiates verification for practical application, enabling bonding of heat-sensitive and dissimilar materials.