Setsunan University (President: Yasuyuki Kubo) will sign a memorandum of understanding on July 8 with five Osaka Prefectural Technical High Schools (hereinafter referred to as "Engineering College Preparatory Program Schools"), which have established engineering college preparatory programs, based on the collaboration agreement between the university and the Osaka Prefectural Board of Education. The aim is to foster "human resources with solid knowledge, skills, and techniques" through high school-university collaboration. Key Points of This Agreement: * This memorandum of understanding will broaden the horizons of students enrolled in Engineering College Preparatory Program Schools, enhance their awareness of career paths and motivation to learn, and inspire their aspirations in engineering. * It will contribute to the revitalization of high school and university education and the development of engineers through mutual dispatch of faculty members. Memorandum Signing Ceremony Overview: 1. Date and Time: July 8, 2026 (Wed) 10:00 - 10:30 (scheduled) 2. Location: Osaka Prefectural Government Building, Grand Salon (2-1-46 Otemae, Chuo-ku, Osaka) 3. Attendees: President Yasuyuki Kubo Vice President Masato Mochinaga Dean of the Faculty of Science and Engineering Hitoshi Nishimura Director of General Affairs Naoki Ura Osaka Prefectural Yodogawa Technical High School Principal Noriyuki Nishio Osaka Prefectural Imamiya Technical High School Principal Seiji Sato Osaka Prefectural Ibaraki Technical High School Principal Naoto Inoue Osaka Prefectural Higashiosaka Mirai Technical High School Principal Tatsuya Nakatani Osaka Prefectural Sakai Technical High School Principal Hidetuki Higashi Educational Promotion Division Deputy Director Satoru Yamamoto Educational Promotion Division High School Reform Section Chief Akiko Yoshida Educational Promotion Division High School Reform Section Councilor Nobuyuki Matsushita Educational Promotion Division High School Reform Section Counci