Where is the DNP booth located?

The DNP booth is number 1104 at the ECTC 2026 venue.

What are the benefits of the glass core substrate?

It allows for higher efficiency and larger areas compared to resin substrates, maximizing performance through high-density TGV.

How does DNP's vapor chamber differ from others?

A key feature is its combination of high thermal conductivity, an ultra-thin profile, and the flexibility to be bent.

AI News NQ Analysis

DNP to Exhibit at ECTC 2026, Showcasing Next-Gen Glass Core Substrates and CPO Technologies

NQ Score 47/100

N1 Content Completeness 5

AI Summary (NQ-processed)

DNP (Dai Nippon Printing) will present advanced semiconductor packaging solutions addressing AI-driven societal challenges at ECTC 2026 in May 2026. Highlights include glass core substrates, thin vapor chambers, and polymer waveguides for Co-Packaged Optics (CPO), all utilizing DNP's proprietary processing technologies.

AI Analysis

Frequently Asked Questions

Q: Where is the DNP booth located?: A: The DNP booth is number 1104 at the ECTC 2026 venue.
Q: What are the benefits of the glass core substrate?: A: It allows for higher efficiency and larger areas compared to resin substrates, maximizing performance through high-density TGV.
Q: How does DNP's vapor chamber differ from others?: A: A key feature is its combination of high thermal conductivity, an ultra-thin profile, and the flexibility to be bent.