Despite TSMC's Cost Concerns, ASML Expects First Chips from High NA EUV in Months
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Christophe Fouquet, CEO of top semiconductor equipment maker ASML, announced on May 19 that the first products made using its new High-NA (Numerical Aperture) EUV lithography machine are expected within months. This follows comments in April from ASML's largest client, TSMC, that the machine is too expensive. Speaking at a conference in Belgium hosted by imec, Fouquet argued that the new equipment will reduce patterning costs for the most advanced logic and memory chips.