TSMC executive: Plans to open chip packaging plant in Arizona by 2029
NQ Score
0/100
N1 Content Completeness
9
AI Summary (NQ-processed)
TSMC executive Kevin Zhang announced plans to establish an advanced chip packaging plant (CoWoS and 3D-IC) in Arizona by 2029. This aims to resolve the supply bottleneck for AI chips for clients like Nvidia and Apple.