What is TSMC's new packaging technology?

It is a new advanced panel-based packaging technology called 'CoPoS (Chip on Panel on Substrate)'.

When will CoPoS enter mass production?

TSMC's CEO, C.C. Wei, stated that it is expected to enter mass production in a few years.

What is the current packaging production capacity like?

Demand is strong and supply is tight. TSMC is expanding its production capacity and also collaborating with OSAT companies to address the situation.

AI News NQ Analysis

TSMC: Deploying CoPoS advanced packaging manufacturing, mass production schedule expected

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AI Summary (NQ-processed)

TSMC CEO C.C. Wei announced the development of the CoPoS advanced packaging manufacturing process, expecting mass production in a few years to meet tight capacity and soaring AI demand, while expanding CoWoS and partnering with OSATs.

AI Analysis

Frequently Asked Questions

Q: What is TSMC's new packaging technology?: A: It is a new advanced panel-based packaging technology called 'CoPoS (Chip on Panel on Substrate)'.
Q: When will CoPoS enter mass production?: A: TSMC's CEO, C.C. Wei, stated that it is expected to enter mass production in a few years.
Q: What is the current packaging production capacity like?: A: Demand is strong and supply is tight. TSMC is expanding its production capacity and also collaborating with OSAT companies to address the situation.