Nanya PCB: Operational Performance to Further Improve This Year, Expanding AI Server Substrate Production

AI Summary (NQ-processed)

Nanya PCB Chairman Chou Ming-jen expects the company's 2026 operational performance to surpass 2025, driven by the growth of AI-driven cloud and edge computing applications. Nanya PCB continues to expand its IC substrate and PCB product applications for AI servers and high-end switches. In IC substrate product development, Nanya PCB is deepening its layout in high-end computing substrates for GPUs, 1.6T switches, custom ASICs (TPUs), and embedded capacitor chips. For automotive electronics substrates, it has completed the development of high-end automotive control chip IC substrates. For mobile device application substrates, it is developing products for next-generation mobile devices and edge AI computing. For general PCBs, it is focusing on new generation mobile device interposers, high-end laptops, server solid-state drives, and LED light beads, actively expanding AI server-related products, and stably mass-producing PCBs for high-end GPU display cards and network cards. External challenges include the impact of US reciprocal tariffs on end-demand and the expansion of US export controls on semiconductors to China, leading to supply chain regionalization and increased operating costs. Opportunities arise from Taiwan's semiconductor supply chain's technological leadership and cluster effects, as well as cloud service providers (CSPs) accelerating independent ASIC development in response to growing customized big data AI computing demand.