Central News Agency (Central News Agency, reporter Zhong Rongfeng, Taipei, July 3) Semiconductor test interface manufacturer Chipbond Technology Corporation announced today that its consolidated revenue for June was NT$574 million, an increase of 5.8% month-on-month and 40.2% year-on-year, setting a new single-month high. In the second quarter, consolidated revenue was NT$1.64 billion, an increase of 20.8% quarter-on-quarter and 34.9% year-on-year, setting a new single-quarter high. Chipbond's consolidated revenue for the first half of the year reached NT$2.997 billion, an increase of 26.6% year-on-year, setting a new high for the same period. Looking ahead to the second half of the year, Chipbond stated that it will continue to benefit from the expansion of artificial intelligence (AI) applications, with demand for graphics processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs) driving supply chain momentum. The company aims to achieve a historic high in revenue this year. Chipbond explained that the growth momentum in June's revenue was mainly driven by strong demand from AI and high-performance computing (HPC) applications. AI and ASIC chips have entered mass production, leading to increased shipments of related products and a simultaneous rise in demand and shipments for high-pin-count, high-frequency test interfaces. Chipbond pointed out that AI and HPC applications have become the largest and fastest-growing segments in its revenue structure. Test interfaces are no longer an independent node in the back-end process but have become a core component of packaging and testing. The importance of test interface manufacturers in the industry chain has significantly increased. IC substrate giant Nan Ya Printed Circuit Board announced today that its consolidated revenue for June was NT$4.684 billion, an increase of 5.5% month-on-month and 50.03% compared to the same period in 2025, setting a second-highest record