NVIDIA Partners with TSMC on CPO Switches, Production Ramp in H2 2025
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NVIDIA's Senior Vice President of Networking, Gilad Shainer, announced on June 3 that NVIDIA has partnered with TSMC to develop the COUPE silicon photonics packaging platform and has begun shipping next-generation co-packaged optics (CPO) switches (Spectrum-X CPO). Production is expected to ramp up in the second half of 2025. Shainer also noted that copper cables remain the preferred choice for short-distance connections.