What is the content of this seminar?

It covers the evolution of semiconductor packaging technology, manufacturing processes, materials/equipment, and latest technologies like CoWoS and chiplets.

How can I participate?

Please apply from the CMC Research website. The viewing URL will be sent to you by email later.

What is the lecturer's background?

Mr. Akira Isobe is President of ISTL. After working at NEC, Tokyo Seimitsu, Nitta Haas, and Disco, he founded ISTL in 2015.

AI News NQ Analysis

[Live Streaming/ZOOM] Seminar: "Basic Course on Semiconductor Packaging Technology" to be held on July 2, 2026 (Thu) Organized by CMC Research Co., Ltd.

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N1 Content Completeness 8

Key facts

[Live Streaming/ZOOM] Seminar: "Basic Course on Semiconductor Packaging Technology" to be held on July 2, 2026 (Thu) Organized by CMC Research Co., Ltd.
CMC Research Co., Ltd. will hold a live streaming seminar on the basics of semiconductor packaging technology on July 2, 2026. The lecturer is Mr. Akira Isobe, President of ISTL. The seminar will cover the latest technologies such as CoWoS and chiplets.
Source: PR TIMES
Date: Wed Jun 03 2026 18:30:01 GMT+0900 (Japan Standard Time)

Direct answer

CMC Research Co., Ltd. will hold a live streaming seminar on the basics of semiconductor packaging technology on July 2, 2026. The lecturer is Mr. Akira Isobe, President of ISTL. The seminar will cover the latest technologies such as CoWoS and chiplets.

Citation: [Live Streaming/ZOOM] Seminar: "Basic Course on Semiconductor Packaging Technology" to be held on July 2, 2026 (Thu) Organized by CMC Research Co., Ltd. (Wed Jun 03 2026 18:30:01 GMT+0900 (Japan Standard Time)), PR TIMES
Source: PR TIMES
Date: Wed Jun 03 2026 18:30:01 GMT+0900 (Japan Standard Time)

AI Summary (NQ-processed)

CMC Research Co., Ltd. will hold a live streaming seminar on the basics of semiconductor packaging technology on July 2, 2026. The lecturer is Mr. Akira Isobe, President of ISTL. The seminar will cover the latest technologies such as CoWoS and chiplets.

AI Analysis

Frequently Asked Questions

Q: What is the content of this seminar?: A: It covers the evolution of semiconductor packaging technology, manufacturing processes, materials/equipment, and latest technologies like CoWoS and chiplets.
Q: How can I participate?: A: Please apply from the CMC Research website. The viewing URL will be sent to you by email later.
Q: What is the lecturer's background?: A: Mr. Akira Isobe is President of ISTL. After working at NEC, Tokyo Seimitsu, Nitta Haas, and Disco, he founded ISTL in 2015.