What is the theme of this seminar?

The basics of semiconductor cleaning and the challenges and prospects of advanced cleaning/drying technologies for 3D integration and Wafer to Wafer bonding.

When will the seminar be held?

July 30, 2026 (Thursday) from 13:00 to 16:00.

How much is the participation fee?

38,500 yen (tax included), which includes electronic materials.

Mr. Hiroyuki Fukue from the Advanced Process Development Section, Alliance Promotion Department, R&D Strategy Division at SCREEN Semiconductor Solutions.

What is the format of the seminar and the detailed URL?

It is a live streaming seminar using Zoom, and the URL is https://andtech.co.jp/seminars/1f158aa2-12d7-6690-ab29-064fb9a95405.

AI News NQ Analysis

AndTech to Hold Semiconductor Cleaning & Wafer-to-Wafer Bonding Zoom Seminar on July 30

NQ Score 80/100

N1 Content Completeness 85

AI Summary (NQ-processed)

AndTech will host a Zoom seminar on July 30, 2026, on semiconductor cleaning basics and advanced cleaning/drying technologies for 3D integration and Wafer-to-Wafer bonding, featuring SCREEN's Hiroyuki Fukue.

AI Analysis

Frequently Asked Questions

Q: What is the theme of this seminar?: A: The basics of semiconductor cleaning and the challenges and prospects of advanced cleaning/drying technologies for 3D integration and Wafer to Wafer bonding.
Q: When will the seminar be held?: A: July 30, 2026 (Thursday) from 13:00 to 16:00.
Q: How much is the participation fee?: A: 38,500 yen (tax included), which includes electronic materials.
Q: Who is the lecturer?: A: Mr. Hiroyuki Fukue from the Advanced Process Development Section, Alliance Promotion Department, R&D Strategy Division at SCREEN Semiconductor Solutions.
Q: What is the format of the seminar and the detailed URL?: A: It is a live streaming seminar using Zoom, and the URL is https://andtech.co.jp/seminars/1f158aa2-12d7-6690-ab29-064fb9a95405.