AndTech to Hold WEB Online Zoom Seminar on "Semiconductor Miniaturization and Advanced Packaging Latest Technologies ~ Trends, Technical Challenges, and Future Prospects of Resist, Lithography, Packaging Resist, and RDL Formation Processes ~" on May 28th (Thursday)
NQ Score
50/100
AI Summary (NQ-processed)
AndTech will host an online seminar on semiconductor miniaturization and advanced packaging technologies.
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Frequently Asked Questions
- Q: What is the main topic of the AndTech seminar?
- A: The seminar focuses on the latest technologies in semiconductor miniaturization and advanced packaging, including trends, technical challenges, and future prospects related to resist, lithography, packaging resist, and RDL formation processes.
- Q: When and how will the seminar be held?
- A: The seminar will be held online via Zoom on Thursday, May 28th, 2026, from 10:00 to 17:00. A Zoom URL will be sent after registration.
- Q: What is the participation fee for the seminar?
- A: The participation fee is 49,500 yen (tax included). Course materials will be distributed electronically.
- Q: Who is the lecturer for this seminar?
- A: The lecturer is Masataka Endo, Representative of E-Reso Research.
- Q: What specific topics will be covered in the seminar?
- A: The seminar will cover trends in semiconductor miniaturization (resist, lithography) technologies, advanced semiconductor packaging technologies, characteristics and applications of packaging resists, and trends in the fine redistribution layer (RDL) formation process.