【CIENS】Announces cumulative disposal of the same securities exceeding NT$300 million
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CIENS has announced the cumulative disposal of common stock in Chipbond Technology Corp. (6147) between May 5 and May 12, 2026, totaling NT$331.275 million. This transaction resulted in a disposal gain of NT$209.566 million, aimed at realizing capital gains and benefiting overall shareholder equity. The company's cumulative holding in Chipbond after this disposal is projected to be 32.261 million shares.