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Seminar Titled 'How to Use Heat Dissipation Devices and Basics of Thermal Design' by Hirokazu Shibata, CEO of Zazoo Design Co., Ltd., to be Held on Wednesday, May 20, 2026!!

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Key facts

  • Seminar Titled 'How to Use Heat Dissipation Devices and Basics of Thermal Design' by Hirokazu Shibata, CEO of Zazoo Design Co., Ltd., to be Held on Wednesday, May 20, 2026!!
  • SSK will host a seminar on May 20, 2026, featuring Hirokazu Shibata, teaching the fundamentals of thermal design for EVs, PCs, and data centers to entry-level engineers.
  • Source: PR TIMES
  • Date: Thu Apr 09 2026 21:00:02 GMT+0900 (Japan Standard Time)

Direct answer

SSK will host a seminar on May 20, 2026, featuring Hirokazu Shibata, teaching the fundamentals of thermal design for EVs, PCs, and data centers to entry-level engineers.

Citation
Seminar Titled 'How to Use Heat Dissipation Devices and Basics of Thermal Design' by Hirokazu Shibata, CEO of Zazoo Design Co., Ltd., to be Held on Wednesday, May 20, 2026!! (Thu Apr 09 2026 21:00:02 GMT+0900 (Japan Standard Time)), PR TIMES
Source
PR TIMES
Date
Thu Apr 09 2026 21:00:02 GMT+0900 (Japan Standard Time)

AI Summary (NQ-processed)

SSK will host a seminar on May 20, 2026, featuring Hirokazu Shibata, teaching the fundamentals of thermal design for EVs, PCs, and data centers to entry-level engineers.

AI Analysis

Frequently Asked Questions

Q: Who is the speaker for the seminar on thermal design?
A: The speaker is Mr. Hirokazu Shibata, who serves as the President and CEO of Zazoo Design Co., Ltd.
Q: When is the seminar scheduled to be held, and what are the hours?
A: It is scheduled to be held on Wednesday, May 20, 2026, from 1:00 PM to 5:00 PM.
Q: What are the two ways participants can attend this seminar?
A: Participants can attend via a live broadcast on Zoom Webinar or watch an archived broadcast available for two weeks.
Q: Who is the primary target audience intended for this seminar?
A: This seminar is intended for engineers who will start thermal design in the future.
Q: What are the main challenges in the current status of thermal design mentioned in the text?
A: The challenges include a rapid increase in power density and shifts to board heat dissipation, conduction-dominant transfer, and liquid or immersion cooling.