Zuken Inc. (Headquarters: Yokohama, President & CEO: Jinya Katsutabe, hereinafter "Zuken") announced its participation in the EDA Alliance of the TSMC Open Innovation Platform® (hereinafter "OIP"). TSMC collaborates with OIP EDA Alliance partners to address growing design needs, accelerate the adoption of the latest process and packaging technologies, and help customers achieve their PPA (Power, Performance, Area) and Time-to-Market (TTM) goals. By joining this alliance, Zuken will further enhance its IC packaging and printed circuit board (PCB) design products with essential capabilities to support multi-die and chiplet-based designs leveraging TSMC's industry-leading technologies. "We are pleased to welcome Zuken to the OIP EDA Alliance," said Aveek Sarkar, Director of Ecosystem Alliance Management at TSMC. "The pursuit of higher performance and power efficiency continues to accelerate innovation in process and packaging technologies. By working closely with EDA partners like Zuken, we can help our customers leverage TSMC's advanced technologies to achieve their design goals for next-generation AI, HPC, and mobile applications." "By joining the TSMC OIP EDA Alliance, Zuken will align its solutions with TSMC's cutting-edge process and advanced packaging technologies. We are committed to helping our mutual customers seamlessly integrate semiconductor, package, and PCB design to meet today's stringent system requirements," said Ryosuke Takagi, Executive Officer, General Manager of Technology Division at Zuken. About Zuken Zuken is a global software company providing advanced electrical and electronic design solutions. Since its founding in 1976, Zuken has established a solid reputation for technological innovation and profitable growth in the EDA industry. Zuken's flagship product lines, "CR-8000" for electronic design and "E3.series" for electrical systems, offer comprehensive 2D/3D system-level solutions with robust design data and configuration management capabili