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HIWIN's March Revenue Hits Record High; Group Focuses on Panel-Level Packaging Positioning Platform

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HIWIN and its affiliate PMI Group are exhibiting at the 2026 Electronic Production Manufacturing Equipment Exhibition, showcasing new nano-scale and multi-dimensional positioning platforms for panel-level packaging inspection and semiconductor wafer processes, anticipating growth driven by AI and semiconductor applications.

AI Analysis

Frequently Asked Questions

Q: What exhibition did HIWIN and its affiliate, PMI Group, attend in 2026?
A: They exhibited at the 2026 Electronic Production Manufacturing Equipment Exhibition.
Q: What new product is PMI Group showcasing at the exhibition?
A: PMI Group is showcasing a new nano-scale positioning stage and a multi-dimensional positioning platform.
Q: How does the nano-scale positioning stage benefit panel-level packaging capacity?
A: Combined with HIWIN's automated subsystems, it can be applied to high-end optical inspection equipment to meet the demands of larger panel sizes.
Q: What are the features of the multi-dimensional positioning platform launched by PMI Group?
A: It has four degrees of freedom for positioning and can instantly correct posture changes of different workpieces during inspection to solve focusing issues.
Q: What are HIWIN's growth drivers and expectations for this year's performance?
A: HIWIN is optimistic about demand from semiconductor, AI automation, and robotics applications, anticipating better operations in the second quarter than the first.